Apple Signs $30 Billion Broadcom Deal to Build 15 Billion US Chips in Colorado

Apple announced a new multiyear agreement with Broadcom today worth more than $30 billion, covering custom silicon components and wireless connectivity technologies for Apple products. Under the deal, Broadcom will produce over 15 billion US-made chips and expand its manufacturing plant in Fort Collins, Colorado with a $1.5 billion capital expenditure investment. Apple describes it as the largest commitment in its American Manufacturing Program to date.

Fort Collins is where Broadcom makes advanced radio frequency components - including FBAR filters - and wireless connectivity chips that go into Apple's product lineup. FBAR filters handle signal interference in cellular radios; every iPhone ships with them. Broadcom's expansion at that facility means more of those components get made on US soil rather than abroad, which is the explicit goal of the deal.

Apple's Biggest US Manufacturing Bet So Far

Apple launched its American Manufacturing Program last year to accelerate domestic supply chain investment. Broadcom has been part of that program since launch, but today's multiyear agreement replaces whatever prior arrangement was in place with a substantially larger one. Apple CEO Tim Cook framed the Fort Collins components as essential to performance and connectivity in Apple products - a rare specific claim from a company that usually keeps supply chain details quiet.

Broadcom CEO Hock Tan confirmed the company will expand its Fort Collins footprint directly. That $1.5 billion capex number is Broadcom's own investment, separate from Apple's $30 billion commitment - meaning real construction and equipment spend, not just a contract value. Six-year deals of this size don't happen on a handshake; Apple's silicon roadmap is being designed around US-sourced wireless components for the foreseeable future.

Part of Apple's $600 Billion US Commitment

Apple announced a $600 billion US economy investment pledge earlier this year, covering manufacturing, supplier commitments, and infrastructure. Today's Broadcom deal counts against that total. Multiple Apple suppliers have announced US expansion plans under the same umbrella, but the Broadcom deal is the single largest AMP commitment Apple has disclosed from that pool.

Apple is already fast-tracking an AI-focused M7 chip for 2027, skipping intermediate silicon tiers to accelerate its AI hardware roadmap. Custom wireless components made in Colorado support that timeline by reducing Apple's exposure to overseas supply chain disruption - a risk that became acute in 2025 when tariff pressures forced several chip sourcing changes across the industry. OpenAI and Broadcom unveiled their own custom inference chip, Jalapeño, earlier this year, putting Broadcom at the center of AI chip production for both Apple and OpenAI simultaneously.

Broadcom's Fort Collins expansion timeline was not disclosed.